Category: PCB Advanced Material Technology
Exhibitor: ORCHEM (SHENZHEN) CO., LTD.
Booth No: AX19
1. Cleaning—Pre-dip—Brown oxide(three steps)
2. Formed uniform rough surface to enhance the adhesive force between the inner layer and resin.
3. Low cost, easy manage and control
4. Excellent heat resistance, suitable for variety of materials and repeated laminating.
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