Category: PCB Advanced Material Technology
Exhibitor: ORCHEM (SHENZHEN) CO., LTD.
Booth No: AX19
1. Owns ionic palladium and colloidal palladium series solution.
2. Formed compact electroless copper deposit with stable deposit rate, provide excellent
3. Low cost, easy manage and control
4. Suitable for variety of plates.
5. The copper deposit is uniform and compact, with good coverage and bonding force.
6. The different process with special potion (FPC, RPCB,PKG)
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