Category: PCB Advanced Material Technology
Exhibitor: ORCHEM (SHENZHEN) CO., LTD.
Booth No: AX19
In the process of PCB, copper surface deposit through direct current in the electrolytic solution,
strengthen the properties of surface deposit
1. Suitable for high aspect ratio products and blind hole
2. High current density provide high efficiency
3. Excellent physical properties (ductility)
4. Low cost, easy control and manage.
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