2012 Suzhou PCB Conference
Grand China - The Key to Reach the New Peak of PCB Industries
Organizer：Taiwan Printed Circuit Association(TPCA)
Co- Organizer：China Electronic Printed Circuit (CCLA)
China Electronic Printed Circuit (CEPC)
Jiang Su Surface Mount Technology(JS-SMT)
Shenzhen Printed Circuit Association( SPCA)
Sponsors：Dongguan Standard Electronic Material Co., Ltd
Dow Electric Material
DuPont China Holding Co., Ltd.
Jetchem International Co., Ltd.
Suzhou Top Creation Machines Co., Ltd.
Unimicron Technology Corp.
Time：May 9 (Wed.)- May 11(Fri.), 2012
Venue：Suzhou International Expo Center
Language：Chinese |
| A1、【Keynote Speech】 May 9 (Wed.) |
【FREE】 Room 103+104 |
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| Time |
Topic |
Speaker |
| 10:30-11:40 |
The Implication to the Supply Market of PCB with Reference to the Latest Rapid Changing of Today Sophisticated Information Technology Industry |
Daniel Chan【Global PCB Council Chairman, IBM China Procurement Company】 |
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| A2、【Discover FPC Future】May 9 (Wed.) |
Room 104 |
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| Time |
Topic |
Speaker |
| 14:00-14:50 |
EMI Shielding Materials for FPC |
Alex King【Vice President, AEMG】 |
| 14:50-15:40 |
FPCs Meet the Trends of Electronic Products |
Eagle Jiang【Senior Industry Analyst, ITRI - IEK】 |
| 15:40-16:30 |
Development Trend of FCCL Materials |
Geli Hung【Deputy Manager, Taiflex Scientific】 |
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| A3、【Explore HR Management】 May 9 (Wed.) |
Room 103 |
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| Time |
Topic |
Speaker |
| 14:00-16:00 |
Labor Contract Law Practice (25 common cases) |
Vincent Chen【Attorney&Counselor at law, Cross-Strait Consulting】 |
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| B1、【Technical Session I】May 10 (Thu.) |
Room 104 |
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| Time |
Topic |
Speaker |
| 10:00-10:30 |
The Surface Finish Effect on the Creep Corrosion in PCB |
Cherie Chen【Deputy Manager, IST】 |
| 10:30-11:00 |
Gold Potassium Cyanide Alternative: Study of Gold Malononitrile in Selectivity ENIG |
Ivan Hsu【Process Technology Engineer, Dow Electric Materials】 |
| 11:00-11:30 |
Aluminum Base CCL with Aluminum Plate and Aluminum Surface Treatment |
Dong She【Engineer, Guangdong Shengyi】 |
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| B2、【Update Environment & Safety Knowledge】May 10 (Thu.) |
Room 103 |
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| Time |
Topic |
Speaker |
| 09:30-10:40 |
Approaching Zero Liquid Discharge in PCB Wastewater Treatment & Recycling |
Nelson Y. L. Cheng【Managing Director, INGREENTREES】 |
| 10:50-12:00 |
Introduced on-line Rinse Wastewater Recycle Technology |
Jiann-Gwo Rong【General Manager, Greenways】 |
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| B3、【Technical Session II】May 10 (Thu.) |
Room 104 |
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| Time |
Topic |
Speaker |
| 13:30-14:00 |
Visual Management Implementing on PCB Industry Analysis |
Longman Cai【FPC Manager, Hi-p(SuZhou)】 |
| 14:00-14:30 |
A Visible High Performance Surface Finish |
Dr.Eddie Chao【Business Development Manager, Cookson Electronics Ltd. - Enthone】 |
| 14:00-14:30 |
Next Generation Electroplating Process for Flat and Thin Copper Plating of Microvia Filling |
Jeffrey Chiang【Process Technology Sr Engineer ,
Dow Electric Materials】
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| B4、【Unlock Material Trends】May 10 (Thu.) |
Room 103 |
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| Time |
Topic |
Speaker |
| 13:30-14:20 |
New Progress of Printed Circuit Board Material with High Thermal Conductivity |
Zhu Datong【Senior Engineer, CEMIA】 |
| 14:20-15:10 |
Trend for the Development of Ultra-Thin IC Substrates |
Lawrence Yen【Vice President , AMC】 |
| 15:10-16:00 |
Base Material Consideration for High Speed Printed Circuit Boards |
Eric Liao【Manager , TUC】 |
| C1、【Master Workshop】May.11 (Fri.) 【Will confer the certificate to the participant】 |
Room 101+102 |
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| Time |
Topic |
Speaker |
9:00-16:30
(12:00~13:30
Noon Break) |
1.The Theory of Soldering and Solder Joint Strength
2.The Relation between LF Soldering and Final Treatment of PCB
3.The Root Cause and Detail Explanation of Failure Analysis
for Delamination
4.Failures or Defects of Traditional PTH |
Frank Bai【Senior Consultant, TPCA】 |
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